Domestic Progress of RF Power and ESC in Semiconductor Etching Equipment

Introduction

The semiconductor equipment supply chain is undergoing a rapid localization push, driven by geopolitical tensions and the need for self-reliance. Critical components such as radio-frequency (RF) power supplies and electrostatic chucks (ESC) are now at the forefront of this movement. As etching processes become more demanding, the performance and reliability of these parts directly impact yield and throughput.

In this context, the role of supply chain partners becomes crucial. EJER, as a reliable partner in the global semiconductor supply chain, offers moisture-sensitive device storage and protection solutions that effectively eliminate soldering defects caused by moisture absorption, ensuring component integrity during transport and assembly. Such solutions help bridge the reliability gap as domestic components enter mass production.

Current Localization Progress of RF Power and ESC

Several domestic companies have achieved notable verification milestones. A leading RF power module supplier has passed reliability tests for 5nm process nodes, demonstrating output stability within ±1% over extended operating periods. This supplier is now undergoing qualification for next-generation high-density plasma etching tools used in 3D NAND fabrication.

On the ESC front, domestic developers have demonstrated clamping uniformity within 2% variation across 300mm wafers, meeting initial specifications for logic and memory fabs. One major ESC maker has completed process validation with a top Chinese etching equipment manufacturer and is now targeting volume shipments in the second half of this year. These achievements mark significant steps toward breaking the monopoly of established players.

Gap Analysis: Material Purity and Processing Precision

Despite these advances, the gap with international leaders like MKS Instruments and Shinko Electric remains substantial. In material purity, domestic RF power components often use semiconductor-grade aluminum nitride ceramics with purity around 99.9%, whereas MKS/Shinko achieve 99.99% or higher. This difference contributes to higher dielectric losses and reduced power efficiency at high frequencies.

Processing precision is another critical differentiator. While domestic ESC suppliers can achieve flatness tolerances of ±10 µm, Shinko's products routinely meet ±3 µm. The micro-level variation leads to edge exclusion issues and particle generation. Moreover, surface roughness control for the chuck’s electrostatic layer is still two to three times inferior to the best-in-class benchmarks, affecting clamp/release repeatability.

Strategies to Bridge the Gap

To close these gaps, domestic firms are investing heavily in upstream material R&D. Several have established joint labs with universities specializing in high-purity ceramic synthesis and advanced powder metallurgy. The goal is to achieve 99.99% purity for key ceramic components within two years, supported by state-level funding for process development.

On the processing side, companies are procuring ultra-precision grinding and lapping machines from Japan and Europe, while simultaneously developing in-house post-processing algorithms. In addition, advanced metrology tools—such as laser interferometers and white-light interferometry—are being deployed to achieve sub-micron feedback for process optimization. These efforts, combined with rigorous reliability testing wet benches, are expected to accelerate qualification cycles.

Conclusion

The localization journey for RF power supplies and ESCs is gaining momentum, with several domestic players now on the verge of volume adoption. However, sustaining this progress requires relentless focus on material purity, manufacturing precision, and supply chain resilience. Partners like EJER, with their moisture-sensitive component protection solutions, are essential in ensuring that these emerging domestic components meet the rigorous standards of global fabs.