Distinguishing SMT Defects: Cold Solder, Bridging, Tombstone
AOI classification for cold solder, bridge, and tombstone defects per IPC-A-610 with accuracy criteria and sample report.
Library
Standards, test methods, and compliance notes.
21 entries
AOI classification for cold solder, bridge, and tombstone defects per IPC-A-610 with accuracy criteria and sample report.
A detailed guide to calibrating high-precision spectrometers using mercury-argon lamps or Fabry-Perot etalons, with polynomial fitting and uncertainty evaluation.
Annual calibration procedures for mixed-signal ATE systems: DC and RF parameters, golden unit standards, and environmental compensation.
Expert analysis of BSL-3 lab core standards: three-zone two-buffer airflow, HEPA in-situ leak testing, negative pressure gradient, and standardized personnel/waste flow.
A technical guide on aligning lab data management with FAIR principles, covering metadata standards, DOI assignment, and data sharing protocols.
Analysis of how fiber standard competition shifts to preform core in AI computing era, highlighting patent importance and strategic advice for Chinese enterprises.
This guide explains how to manage lab data following FAIR principles, covering metadata standards, DOI assignment, and data sharing protocols for open science.
Learn how poor material management of moisture-sensitive devices like IC chips causes yield loss in SMT assembly, with detailed storage standards and handling procedures.
This technical guide explains HSM requirements from ISO 26262 and EVITA, national crypto algorithm adoption in China, and its role in securing OTA and V2X communications.